Virtual Reactor Design and Process Validation of 3D ICP Chambers

June 29 | 3:00 - 4:00pm CET

 

Inductively Coupled Plasma (ICP) Reactors are widely used in semiconductor manufacturing to efficiently generate high-density plasma for wafer processing.

Join this application-specific, 45-minute webinar where we showcase ESI's multi-physics solutions used to model ICP chambers including various asymmetric's in geometry and complexity in chemistry. 

AGENDA
  • High-fidelity 3D simulation incorporating chamber, coil and wafer geometric complexity
  • Parametric design space exploration including coil design, Faraday shield placement. power, pressure, flowrate and plasma chemistry
  • ICP reactors performance optimization and process calibration 

This Webinar is free of charge.



In case you don't see the form or can't register please follow this link.

Optimizing Chamber Design and Process Parameters with Complex Plasma Chemistry Models

September 9 | 3:00 - 4:00pm CET

 

Simulations of industrial low-temperature plasmas are often challenging due to the use of complex plasma chemistry, especially in the presence of multiple gases in the feedstock mixture. This webinar will showcase examples of 2D/3D Inductively Coupled and Capacitively Coupled plasma simulations in such gas mixtures.

AGENDA
  • How to build plasma reactions for real gas mixtures
  • See usage of 0D model for mechanism reduction and process space exploration
  • Learn best practices in model set up for high simulation fidelity and faster convergence
  • Visualize source functions, reaction pathways, ion energy and angular distributions
  • How to quickly import plasma gas phase chemistry mechanisms in Chemkin format

This Webinar is free of charge.



In case you don't see the form or can't register please follow this link.

Our experts:

Ananth Bhoj

Principle Technical Manager
with over 15 years of experience in developing plasma models

Abhra Roy

Technical Business Development Manager
with over 15 years experience in modeling and simulations for plasma and thin-film modeling​​​​​​